Modern electronic systems possess very high functionality and at the same time they are very compact in the design and type of construction. The amount of space that device designers make available for the electronic equipment is always limited and therefore needs to be utilized in the best possible way.
The electronic components have an increasingly higher density and larger number of connections.
For those reasons, circuit boards need to have a high interconnection density, must be very reliable and should utilize the available space in an optimum degree. Flexible circuit boards are one possibility, but the most reliable technology is offered by the flex-rigid circuit board.
This paper will give an introduction into the techniques of flex-rigid circuit boards. Various build-up construction techniques will be presented and typical applications will be shown.
The paper will present the latest state-of-the-art designs with ultra-thin substrates that fit into smart electronic devices for high-tech applications e. g. in medical devices or in industrial electronics.